Dicing Saw Supply Minder Machine

Inquiry

Product details of the dicing saw

Product Information

Minder Machine dicing saw is manufactured by the latest materials as we always keep track of the latest technological developments. As it is manufactured in strict accordance with the international quality standard, the product is of assured quality. Compared with other dicing saw manufacturers, Minder-Hightech has more comprehensive R&D capabilities.

Product Introduction

Dicing saw

MDHYDS6L 6inch Dicing saw for semiconductor industry

The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.

Material suitable

Si, GaAsLiNbO3, Al2O3, Ceramic, Glass, Quartz, PCB, EMC etc.

Related Parameters

	MDHYDS6L	MDHYDS6M	MDHYDS6H
Multi plate dicing	√	√	√
Auto focus	√	√	√
Auto align	*	*	√
Shape recognition	-	-	*
Dicing mark check	-	*	*
Non contact height test	-	*	√
Blade broken check	-	*	*
Dual camera align system	-	*	√

			MDHYDS6L	MDHYDS6M	MDHYDS6H
Spec	dicing size	mm	ф6”〡□150	ф6”〡□150	ф6”〡□150
Spec	dicing depth	mm	≤4mm or custom	≤4mm or custom	≤4mm or custom
Main spindle	rotaty speed	minˉ¹	3000∽40000	10000∽50000	10000∽50000
Main spindle	power	kW	AC,1.25at40000minˉ¹	AC,1.5at50000minˉ¹	DC,1.5at50000minˉ¹
X axis	stroke	mm	250	250	250
X axis	speed range	mm/s	0.1∽400	0.1∽400	0.1∽500
Y axis	stroke	mm	170	170	170
	resolution	mm	0.0001	0.0001	0.0001
	single move accuracy	mm	≤0.003/5	≤0.003/5	≤0.002/5
	F accuracy	mm	≤0.005/170	≤0.005/170	≤0.004/170
Z axis	stroke	mm	30	30	30
	max blade size:	mm	ф58	ф58	ф58
	resolution	mm	0.0001	0.0001	0.0001
	accuracy	mm	0.001	0.001	0.001
R axis	rotary range	deg	380	380	380
Basic required	power	KVA	3.0（single phase，AC220V）	3.0（single phase，AC220V）	3.0（single phase，AC220V）
	air	Mpa L/min	0.5∽0.6max consumption180	0.5∽0.6max consumption200	0.5∽0.6max consumption200
	cutting fluid	Mpa L/min	0.2∽0.3max consumption3.0	0.2∽0.3max consumption3.5	0.2∽0.3max consumption3.5
	cooling water	Mpa L/min	0.2∽0.3max consumption1.5	0.2∽0.3max consumption1.5	0.2∽0.3max consumption1.5
	exhaust	m³/min	1.5	1.5	1.5
	size	mm	5809101650	5809101650	5809101650
	weight	kg	500	500	500

Features

Blade database management

Workpiece cutting database management

Auto focus function

Two-way lifting knife cutting function

Compensation function for blade exposure

Multiple safety guarantees and alarm functions

ApplicationS

IC, Optical, communication, LED, MEMS, Medical, NTC, Quartz, Diode, Triode etc.

1 (1) (2)

1 (3) (3)

1 (4) (2)

2 (5) (2)

2 (2) (2)

2 (1)

Company Feature

• Based on customer's needs, Minder Machine fully exerts our own advantages and market potential. We constantly innovate service methods and improve service to meet their expectations for our company.
• Established in our company has now become a modern enterprise through years of wind and rain. We have expanded our business range and improved the brand recognition.
• The open and smooth traffic creates convenience for the transportation and timely supply of industrial machinery.
Leave your contact information, and Minder Machine provides you with consultation and after-sales service.

we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.

MDTFC120 Wafer Two fluid cleaning machine

UV Curing Machine

MDHYDS12B 12 inch Discing Saw for seminconductor

MDHYDS12B 12 inch Discing Saw

MDHYDS6M 6inch Dicing Saw for Semiconductor Industry

Minder-Hightech become a very popular brand in industrial world. We created "MinderPack" to focusing on the machinary on packages solution and other high value machines.