News and Case
A customer from Brazil who makes display screen casings discovered during R&D that their products were peeling off after glue was dispensed.
After communicating with MH engineers, we customized this equipment solution for them: direct injection plasma+rotary plasma+glue dispensing.
After testing, the problem of peeling off after dispensing has been perfectly solved.
https://www.facebook.com/profile.php?id=61561304064346
After communicating with MH engineers, we customized this equipment solution for them: direct injection plasma+rotary plasma+glue dispensing.
After testing, the problem of peeling off after dispensing has been perfectly solved.
https://www.facebook.com/profile.php?id=61561304064346
https://www.youtube.com/embed/6PZBt8LYgo4
Customized Automatic Laser Positioning Multi-head Screw Locking Robot / Automatic Screw Feeder
Ultrasonic welding of 50mm² metal wire terminals
High viscosity AB Glue Precision Dispensing Machine
Semiconductor Packaging Laboratory Equipment：
Oven, Plasma Surface Treatment, Die bonder, Wire bonder
Oven, Plasma Surface Treatment, Die bonder, Wire bonder
Solution for Removing Photoresist (RP) from Semiconductor Wafers
Our clients are all mechanical industry practitioners and professionals from around the world. We specialize in most engineering processes,
such as precision welding, screw robots, welding, bonding, plasma surface treatment, electronic assembly, robotics, wire bonding, plasma cleaning.
such as precision welding, screw robots, welding, bonding, plasma surface treatment, electronic assembly, robotics, wire bonding, plasma cleaning.
no data