IC Package full line equipments for laboratory use

Minder-Hightech is an integrated supplier of equipment for entire semiconductor packaging industry.

 The demand proposed by the European client this time is to customize small manual equipment for chip packaging for laboratory teaching.

 After multiple rounds of communication in the early stage, we have integrated and customized four devices required for IC packaging for the customer: Wafer Oven, Plasma surface treatment machine, Wire bonding machine, Die bonder.

 The machine is ready and placed in our sample room.

 Before shipment, the customer's engineers came to Guangzhou from Europe to learn operation of each device.

 After half a month of training, the customer became familiar with the operation of each machine before we shipped the goods.

 This is another pleasant collaboration.