Semicon Packaging Processes
Automatic TO Wire Bonding machine
2024
10
25
18
views
Application:
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.
2024
10
25
41
views
Auto deep access Gold Wire Ball Bonder Stud ball
2024
05
21
23
views
Dicing saw for semiconductor industry
The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.
2024
05
09
42
views
2024
05
06
16
views
