Semicon Packaging Processes
Automatic TO Wire Bonding machine
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Application:
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.
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Auto deep access Gold Wire Ball Bonder Stud ball
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Dicing saw for semiconductor industry
The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.
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