Through the principle of optical projection, to the gas, liquid, solid Three-phase interface profiles were used for fidelity acquisition precision analysis.

Automatic spray painting robot Suitable for a variety of paints with different concentrations, automatic coloring

Ultrasonic welding of 50mm² metal wire terminal

Professional Improvement of Special Products for Customers Customized Assembly Line Atmospheric Plasma Cleaning Machine

Automatic TO Wire Bonding machine

Application: High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.

Auto deep access Gold Wire Ball Bonder Stud ball

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. We are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience. Our main products include: Die bonder, Wire bonder, Wafer grinder, Dicing saw, Plasma surface treatment, Photoresist removing machine, Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, capacitor winding machine, Bonding tester, etc. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

Dicing saw for semiconductor industry The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.