MDHYDS12B 12 inch Discing Saw
Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package
Material suitable：Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
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MDHYDS8FA |
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Multi plate dicing |
√ |
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Auto focus |
√ |
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Auto align |
√ |
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Shape recognition |
* |
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Dicing mark check |
* |
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Non contact height test |
√ |
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Blade broken check |
* |
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Dual camera align system |
√ |
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MDHYDS8FA |
MDHYDS12B |
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Spec |
dicing size |
mm |
ф8”〡□250 |
ф12”〡□300 |
ф420”〡□360 |
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dicing depth |
mm |
≤4mm or custom |
≤4mm or custom |
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Main spindle |
rotaty speed |
minˉ¹ |
6000∽60000 |
6000∽60000 |
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power |
kW |
DC,2.4at60000minˉ¹ |
DC,2.4at60000minˉ¹ |
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X axis |
stroke |
mm |
260 |
310 |
450 |
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speed range |
mm/s |
0.1∽600 |
0.1∽800 |
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Y axis |
stroke |
mm |
260 |
170 |
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resolution |
mm |
0.0001 |
310 |
450 |
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single move accuracy |
mm |
≤0.002/5 |
≤0.002/5 |
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F accuracy |
mm |
≤0.005/260 |
≤0.005/310 |
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Z axis |
stroke |
mm |
40 |
40 |
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max blade size: |
mm |
ф58 |
ф58 |
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resolution |
mm |
0.00005 |
0.00005 |
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accuracy |
mm |
0.001 |
0.001 |
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R axis |
rotary range |
deg |
380 |
380 |
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Basic required |
power |
KVA |
4.0（three phase，AC380V） |
5.0（three phase，AC380V） |
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air |
Mpa L/min |
0.5∽0.6max consumption260 |
0.5∽0.6max consumption400 |
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cutting fluid |
Mpa L/min |
0.2∽0.3max consumption4.0 |
0.2∽0.3max consumption7.0 |
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cooling water |
Mpa L/min |
0.2∽0.3max consumption1.5 |
0.2∽0.3max consumption3.0 |
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exhaust |
m³/min |
5.0 |
8.0 |
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size |
mm |
900*1050*1800 |
1170*1030*1850 |
1380*1300*1850 |
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weight |
kg |
1050 |
1400 |
1550 |
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