MDHYDS6L 6inch Dicing Saw for Semiconductor Industry
Application:
IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc.
Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.
|
|
|
|
MDHYDS6L |
MDHYDS6M |
MDHYDS6H |
|
Spec |
dicing size |
mm |
ф6”〡□150 |
ф6”〡□150 |
ф6”〡□150 |
|
dicing depth |
mm |
≤4mm or custom |
≤4mm or custom |
≤4mm or custom |
|
|
Main spindle |
rotaty speed |
minˉ¹ |
3000∽40000 |
10000∽50000 |
10000∽50000 |
|
power |
kW |
AC,1.25at40000minˉ¹ |
AC,1.5at50000minˉ¹ |
DC,1.5at50000minˉ¹ |
|
|
X axis |
stroke |
mm |
250 |
250 |
250 |
|
speed range |
mm/s |
0.1∽400 |
0.1∽400 |
0.1∽500 |
|
|
Y axis |
stroke |
mm |
170 |
170 |
170 |
|
resolution |
mm |
0.0001 |
0.0001 |
0.0001 |
|
|
single move accuracy |
mm |
≤0.003/5 |
≤0.003/5 |
≤0.002/5 |
|
|
F accuracy |
mm |
≤0.005/170 |
≤0.005/170 |
≤0.004/170 |
|
|
Z axis |
stroke |
mm |
30 |
30 |
30 |
|
max blade size: |
mm |
ф58 |
ф58 |
ф58 |
|
|
resolution |
mm |
0.0001 |
0.0001 |
0.0001 |
|
|
accuracy |
mm |
0.001 |
0.001 |
0.001 |
|
|
R axis |
rotary range |
deg |
380 |
380 |
380 |
|
Basic required |
power |
KVA |
3.0（single phase，AC220V） |
3.0（single phase，AC220V） |
3.0（single phase，AC220V） |
|
air |
Mpa L/min |
0.5∽0.6max consumption180 |
0.5∽0.6max consumption200 |
0.5∽0.6max consumption200 |
|
|
cutting fluid |
Mpa L/min |
0.2∽0.3max consumption3.0 |
0.2∽0.3max consumption3.5 |
0.2∽0.3max consumption3.5 |
|
|
cooling water |
Mpa L/min |
0.2∽0.3max consumption1.5 |
0.2∽0.3max consumption1.5 |
0.2∽0.3max consumption1.5 |
|
|
exhaust |
m³/min |
1.5 |
1.5 |
1.5 |
|
|
size |
mm |
580*910*1650 |
580*910*1650 |
580*910*1650 |
|
|
weight |
kg |
500 |
500 |
500 |
