MDHYDS12B 12 inch Discing Saw for seminconductor
Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package
Material suitable：Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
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|
MDHYDS8FA |
MDHYDS12B |
MDHYDS12FA |
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Multi plate dicing |
√ |
√ |
√ |
|
Auto focus |
√ |
√ |
√ |
|
Auto align |
√ |
√ |
√ |
|
Shape recognition |
* |
* |
* |
|
Dicing mark check |
* |
* |
* |
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Non contact height test |
√ |
√ |
√ |
|
Blade broken check |
* |
* |
* |
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Dual camera align system |
√ |
√ |
√
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|
MDHYDS12B |
MDHYDS12FA |
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Spec |
dicing size |
mm |
ф12”〡□300 |
ф420”〡□360 |
ф12”〡□275 |
|
dicing depth |
mm |
≤4mm or custom |
≤4mm or custom |
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Main spindle |
rotaty speed |
minˉ¹ |
6000∽60000 |
6000∽60000 |
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|
power |
kW |
DC,2.4at60000minˉ¹ |
DC,2.4at60000minˉ¹ |
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X axis |
stroke |
mm |
310 |
450 |
310 |
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speed range |
mm/s |
0.1∽800 |
0.1∽1000 |
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|
Y axis |
stroke |
mm |
170 |
310 |
|
|
resolution |
mm |
310 |
450 |
0.0001 |
|
|
single move accuracy |
mm |
≤0.002/5 |
≤0.002/5 |
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|
F accuracy |
mm |
≤0.005/310 |
≤0.005/310 |
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|
Z axis |
stroke |
mm |
40 |
40 |
|
|
max blade size: |
mm |
ф58 |
ф58 |
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resolution |
mm |
0.00005 |
0.00005 |
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accuracy |
mm |
0.001 |
0.001 |
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R axis |
rotary range |
deg |
380 |
380 |
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|
Basic required |
power |
KVA |
5.0（three phase，AC380V） |
7.0（three phase，AC380V） |
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|
air |
Mpa L/min |
0.5∽0.6max consumption400 |
0.5∽0.6max consumption550 |
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|
cutting fluid |
Mpa L/min |
0.2∽0.3max consumption7.0 |
0.2∽0.3max consumption9.0 |
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cooling water |
Mpa L/min |
0.2∽0.3max consumption3.0 |
0.2∽0.3max consumption3.0 |
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exhaust |
m³/min |
8.0 |
8.0 |
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size |
mm |
1170*1030*1850 |
1380*1300*1850 |
1200*1600*1800 |
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|
weight |
kg |
1400 |
1550 |
2000 |
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