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MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 1
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 2
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 3
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 4
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 5
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 1
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 2
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 3
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 4
MDHYDS6M 6inch Dicing Saw for Semiconductor Industry 5

MDHYDS6M 6inch Dicing Saw for Semiconductor Industry

Application:

IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc.

Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.

 

 

 

MDHYDS6L

MDHYDS6M

MDHYDS6H

Multi plate dicing

Auto focus

Auto align

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Shape recognition

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Dicing mark check

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Non contact height test

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Blade broken check

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Dual camera align system

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 Introduction

 

The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.

Features:

Blade database management

Workpiece cutting database management

Auto focus function

Two-way lifting knife cutting function

Compensation function for blade exposure

Multiple safety guarantees and alarm functions

 

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