MDZWSQB-1522 Auto deep access Wire Ball Bonder
Features:
1. Constant Loop Height, Constant LoopLength,Increase the Looping Consistency.
2. Continuous real time monitoring and controlling of wire deformation
3. Optimized PR especially on LTCC/HTCC
4.Bump/BSOB/BBOS.
Product advantages:
|
Adaptability |
1-High efficient transducer，more reliable quality ofbond； |
|
2-Table tear and Clamp tear； |
|
|
3-Sectionalized bonding parameter, for the different interface； |
|
|
4-Multi sub-program to be combined； |
|
|
5-SECS/GEM protocol； |
|
|
Stability |
6-Real time detection of wire deformation； |
|
7-Real time detection of ultrasonic power； |
|
|
8-Second display screen； |
|
|
Consistency |
9-Constant loop height,loop length； |
|
10-online BTO for wedge tool calibration by uplook video. |
Parametric Metrics
s
|
Bonding Area |
X*Y：150*120mm（Inline）150*225mm（Fixed workholder）Z：50mm |
|
Theta rotation |
-360°~360° |
|
Placement precision |
±3um@3S ±0.00018°@3S |
|
Bond force |
1-300g precision0.1g programmable |
|
Wire |
Au wire:12-75um，Al wire:20- 100um |
|
Ribbon |
Au ribbon 25*12.7μm-250*25.4μm |
|
Deep Access |
Compatible 16/19mm capillary |
|
EFO |
0~100mA，0~4000us programmable multi-Profile mode |
|
UPH |
2~7 wire per second |
