Deep access Automatic Wire Wedge ball Bonder for microwave product
Features
1. Constant Loop Height, Constant LoopLength,Increase the Looping Consistency.
2. Continuous real time monitoring and controlling of wire deformation
3. Optimized PR especially on LTCC/HTCC
4.Bump/BSOB/BBOS.
Product advantages
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Adaptability |
1-High efficient transducer，more reliable quality ofbond； |
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2-Table tear and Clamp tear； |
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3-Sectionalized bonding parameter, for the different interface； |
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4-Multi sub-program to be combined； |
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5-SECS/GEM protocol； |
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Stability |
6-Real time detection of wire deformation； |
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7-Real time detection of ultrasonic power； |
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8-Second display screen； |
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Consistency |
9-Constant loop height,loop length； |
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10-online BTO for wedge tool calibration by uplook video. |
Parametric Metrics
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Bonding Area |
X*Y：150*120mm（Inline）150*225mm（Fixed workholder）Z：50mm |
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Theta rotation |
-360°~360° |
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Placement precision |
±3um@3S ±0.00018°@3S |
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Bond force |
1-300g precision0.1g programmable |
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Wire |
Au wire:12-75um，Al wire:20- 100um |
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Ribbon |
Au ribbon 25*12.7μm-250*25.4μm |
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Deep Access |
Compatible 16/19mm capillary |
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EFO |
0~100mA，0~4000us programmable multi-Profile mode |
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UPH |
2~7 wire per second
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