MDZW-DJTP2032 Automatic dispensing die attach machine
Dispensing die attach for HIC MCM Microwave Optoelectronics
1. Using graphical operation programming to effectively improve programming
efficiency and reduce personnel requirements.
2. In low pressure mode, contact height detection is fast and accurate, effectively
controlling the consistency of adhesive thickness.
3. It can be connected to the automatic SMT machine, operate independently,
and share parameters, coordinates, and recognition height.
4. Main light+7 circular lights, effectively dealing with different interfaces.
5. Can call different chip shape subroutines.
6. The coexistence of low pressure contact height measurement and non-contact image focusing height measurement.
|
Model |
MDZW-DJTP2032 |
|
Dispensing part |
|
|
XYZ axis |
stroke 200mm * 320mm * 50mm |
|
Platform repeated positioning accuracy |
soil 2um@3s |
|
Equipment comprehensive positioning accuracy |
soil 3um@3s Soil 0.1@3s (Standard Plate Test) |
|
Chip size |
5~1500g, 0.1g resolution, real-time full closure control |
|
Chip thickness |
0.076-1mm (3-40mil, standard) thinnest to 0.05mm (2mil, optional) |
|
Glue dispensing mode |
air pressure dispensing, dipping, spraying, etc |
|
Electric injection frequency |
120 times/second |
|
Optical system |
Main camera 4.2mm * 3.5mm field of view range |
|
Glue packaging |
compatible with 3CC/5CC/10CC |
|
Material system |
optional track or workbench mode |
|
External dimensions of individual automatic SMT machine |
840 * 1220 * 2000mm (excluding connecting device) |
|
Weight |
700KG |
|
Power supply |
AC220V earth 10%, 50-60HZ, 10A |
|
Compressed air |
>=0.5MPa, flow rate>50LPM, |
|
Purification gas source vacuum pipeline pressure |
<-85Kpa, pumping speed>50LPM |
|
stability |
Linear motor platform, fast and stable; Real time data recording, traceable; |
|
Accuracy |
Comprehensive positioning accuracy soil 3um@3s ; Multi point positioning to cope with shell deformation; Chinese cultural interface, what is seen and what is gained; |
|
Usability |
Graphical operation, convenient and fast; Standardized programming, quickly getting started |
|
Die attach part |
|
|
XYZ axis |
stroke 200mm * 320mm * 50mm |
|
Platform repeated positioning accuracy |
soil 2um@3s |
|
Equipment comprehensive positioning accuracy |
soil 3um@3s Soil 0.1@3s (Standard Plate Test) |
|
UPH |
1000-1500 (with camera calibration) 2000-2500 (without camera calibration) |
|
Adhesive pressure |
5-1500g 0.1g resolution real-time full closure control |
|
Chip size |
length * width: 0.17mm-25mm |
|
Thickness |
50um-17mm |
|
Optical system |
Main camera 4.2mm * 3.5mm field of view range Auxiliary camera 4.2mm * 3.5mm field of view |
|
Suction nozzle |
quantity of 12, supporting automatic replacement and online automatic calibration |
|
Material system |
support 24 gel boxes/waffle boxes, optional rail or workbench mode |
|
External dimensions of individual automatic SMT machine |
840 * 1220 * 2000mm (excluding connecting device) |
|
Weight |
800KG |
|
Power supply |
AC220V earth 10%, 50-60HZ, 10A |
|
Compressed air |
>=0.2MPa, flow rate>5LPM, |
|
Purification gas source vacuum pipeline pressure |
<-85Kpa, pumping speed>50LPM |
