Automatic wire wedge bonder
MD-ETECH1850 automatic ultrasonic wedge bonder using servo system, 4"*4" working stroke, can suitable for diversification LED products. Sealed clean ultra-silent working table provides a good working environment. With technical innovation, precision and capacity are improved obviously. The high technology, high precision, high accuracy pointing system can offer a more excellent production scheme with good capacity and quality. Operate with Chinese and English menu, friendly user interface.
MD-Etech1850G is upgrade version which suit for win7 and faster response team.
Specification
|
Bonding Head and Table |
|
|
XY travel |
4"*4"(LED); 3"*3"(COB) |
|
0 |
±360° |
|
Z travel |
0.4" |
|
Resolution |
0.02mil |
|
Bond angle |
30° |
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Wire size |
0.7mil~2.0mil |
|
Bond force |
15~200gm(adjustable) |
|
Bond power |
0~2Watt(adjustable) |
|
Bond head clearance |
4.8mm |
|
F/T resolution |
Adjustable |
|
Bonding through put |
UPH 10k(LED) 8wire/sec(COB, based on 2mm wire length) |
|
Transducer and Power Unit |
|
|
Transducer |
Aluminum alloy light weight type |
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Power generator |
Auto-cal ultrasonic generator |
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Alignment Reference |
|
|
Die |
0, 1 or 2 points |
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Substrate |
0, 1 or 2 points |
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Image Recognition System |
|
|
XY |
±1mm(3.5 times amplification) |
|
0 |
±15° |
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Accuracy |
±1/4 pixel |
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Recognition time |
120ms |
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Optic |
|
|
Microscope |
10~30 times, dual FOV zoom |
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Power Supply |
|
|
Voltage |
AC110V/220V |
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Frequency |
50/60HZ |
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Power consumption |
800W(Max) |
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Program Storage Capacity |
|
|
Number of program |
Practically unlimited |
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Number of chips |
1000chips/program |
|
Number of wire |
1000wire/chip |
|
Dimensions and Weight |
|
|
Weight |
280kg |
|
Size |
750(D)*1050(W)*1450(H)mm |
