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MDSJSQW-3045 automatic big area deep access wedge bonder 1
MDSJSQW-3045 automatic big area deep access wedge bonder 2
MDSJSQW-3045 automatic big area deep access wedge bonder 3
MDSJSQW-3045 automatic big area deep access wedge bonder 1
MDSJSQW-3045 automatic big area deep access wedge bonder 2
MDSJSQW-3045 automatic big area deep access wedge bonder 3

MDSJSQW-3045 automatic big area deep access wedge bonder

Equipment parameters

■ scope of application: discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc

■ type of welding wire: gold wire (12.5um-75um)

■ arc length and arc height of welding line: fully programmable

■ welding wire accuracy: ± 3um, @ 3sigma

■ ultrasonic: 0 ~ 5W control accuracy, step flexible application ability

■ pressure: 0-200g, mechanical resolution 0.1g, force control repeatability < 1g

■ suitable cleaver length: 16mm, 19mm

■ welding area: large area: 330mmx432mm, ± 220 ° rotation range

■ welding wire speed: 3 ~ 7wire / S (@ 25um gold wire & 1mm wire length)

■ operating system: Windows

■ net weight of equipment: 1350kg

Key features

Real time deformation monitoring;

Real time ultrasonic energy monitoring;

Fixed length and fixed height arc control capability;

Tail wire control mechanism of piezoelectric ultrasonic motor;

Deep cavity bonding capacity of 16mm and 19mm cleaver length;

HD bonding head maintenance image auxiliary tool;

Large welding area.

 

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