MD-S800 Automatic wire ball bonder

1.   Technical Specification

X-Y stage stroke:

X-Y stroke: 65*70 mm

X-Y stage accuracy: 0.04 mil(1um)

Z bonder stroke: 9.0 mm

Image recognition system and optical system

Image recognition method: 256 grey scale, can recognize R/G/B and matte chips

Resolution: 640*480

Optical magnification: 2~4, adjustable

Image recognition accuracy: ±0.37 um

Ultrasonic generator and transducer

Ultrasonic generator: UTHE 10H-P2

Ultrasonic transducer: UTHE 70PT

Temperature controller: OMRON E5CSL

User interface: Windows xp system, Chinese and English language

Program memory size: 1000

Min golden wire: 0.5 mil

Velocity

Bonding cycle: 70ms/2mm wire

Unit per hour: 28K (single wire), 15K (dual wire)

Working condition

Voltage/Frequency: AC220V/50-60Hz

Compressed air: ≥0.3~0.5 Bar

Rated power: 1200 W

Gas consumption: 80 LMP

Weight and size

Weight: 800 kg

Size: 1230mm*940*1660