MD-S series automatic semiconductor wire ball bonder
Md-S808 838 automatic semiconductor wire ball welder
Speed:
21W/S for 2mm
Welding line area）：56*80mm
Leadframe width）：28-90mm
Application
IC(SOP,SOT,DIP,BGA,COB）
LED(SMD,COB）
Advantage:
Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption
The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution
High resolution 0.1um worktable, + / - 2um welding line accuracy
High resolution EFO
Full closed loop force control
2.5mil copper wire
Optional Automatic conversion of product types
|
Specification |
|
|
Bonding Capability |
48ms/w (2mm Wire Length) |
|
Bonding Speed |
+/-2Ym |
|
Wire Length |
Max 8mm |
|
Wire Diameter |
15-65ym |
|
Wire Type |
Au, Ag, Alloy, Cu Pd, Cu |
|
Bonding Process |
BSOB/BBOS |
|
Looping Control |
Ultra Low Looping<50ym |
|
Bonding Area |
56*80mm |
|
XY Resolution |
0.1um |
|
Ultrasonic Frequence |
138KHZ |
|
PR accuracy |
+/-0.37um |
|
Applicable Magazine |
|
|
L |
120-305mm |
|
W |
36-98mm |
|
H |
50-180mm |
|
Pitch |
Min 1.5mm |
|
Applicable Leadframe |
|
|
L |
100-300mm |
|
W |
28-90mm |
|
T |
0.1-1.3mm |
|
Conversion Time |
|
|
Different Leadframe |
<15min |
|
Same Leadframe |
<4min |
|
Operation Interface |
|
|
MMI Language |
Chinese, English） |
|
Dimension, Weight |
|
|
Overall Dimension W*D*H |
950*920*1850mm |
|
Weight |
750KG |
|
Facilities |
|
|
Voltage |
190-240V |
|
Frequency |
50Hz |
|
Compressed Air |
6-8Bar |
|
Air Consumption） |
80L/min |
