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RIE Plasma Photoresist Remove Machine 1
RIE Plasma Photoresist Remove Machine 2
RIE Plasma Photoresist Remove Machine 3
RIE Plasma Photoresist Remove Machine 1
RIE Plasma Photoresist Remove Machine 2
RIE Plasma Photoresist Remove Machine 3

RIE Plasma Photoresist Remove Machine

RIE PLASMA Remove Photoresist Machine

Silicon carbide etching

Surface cleaning after etching

DESCUM

Hard mask layer, dry removal

Silicon oxide or silicon nitride etching

Removal of optical resistance between media

Surface residue removal

 

PLASMA source

RF

Power

ICP

_

BIAS

1000W(option)

Applicable scope

4~8 inch

Single processing slice count

1

Appearance dimensions

850mmx900mmx1850mm

System control

PLC

Automation level

Manual

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