RIE PLASMA Remove Photoresist Machine
Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removal
PLASMA source
RF
Power
ICP
_
BIAS
1000W(option)
Applicable scope
4~8 inch
Single processing slice count
1
Appearance dimensions
850mmx900mmx1850mm
System control
PLC
Automation level
Manual