PVD Physical Vapor Deposition

Product introduction:

It is widely used in the batch production of semiconductor and LED production lines, and can meet the various process requirements for the uniform deposition of thin films on the substrate of aluminum, titanium, chromium, molybdenum, vanadium, nickel, silver, indium and other metals, ITO and other oxides.

Equipment composition Structure:

There are three types of equipment: 500, 700 and 900.The system is mainly composed of evaporation chamber, rotating substrate frame, light heating system, electron gun and electron gun power supply, quartz crystal oscillation film thickness monitor, working gas circuit, air extraction system, control system, installation machine, etc. It reflects the overall appearance of the cube and is applicable to the isolation installation of the partition wall of the ultra-clean room.

Technical indicators:

1. Limit vacuum: ≤ 2.6 × 10-5 Pa (after baking and degassing);

2. System vacuum leak detection rate: ≤ 6.6 × 10-8 Pa.l/S；

3. The system starts to extract air from the atmosphere (fill dry nitrogen when exposed to the atmosphere), and the 500 and 700 models can reach the working vacuum 5.0×10-4Pa in less than 30 minutes, 900 type can reach working vacuum 2.6 × 10-4 Pa within 20 minutes；；

4. Evaporation rate: 500 type: 0.1 ～ 15 A/sec; 700 type: 0.1~20 A/sec; 900 type: 0.1 ～ 30A/sec;

5. Film thickness uniformity:

U film thickness nonuniformity ≤± 5%,

Non-uniformity between u pieces ≤± 5%,

U Nonuniformity between batches ≤± 5%;

6. Electronic gun and power supply: 500, 700: 4 × 25CC water-cooled crucible; Type 900: 4 × 40CC water-cooled crucible; Power: 500 type: 6KW; 700 type: 8KW; 900 type: 10KW;

7. The quartz crystal oscillating film thickness monitor can realize multi-stage rate climbing, programmable discrete input/output, and realize closed-loop control of evaporation rate of electron beam evaporation source,

Display of film thickness: 0 ～ 999.9 k A, film forming rate: 0 ～ 999 A/s;

8、Substrate frame：

9. Light heating system: heating temperature is continuously adjustable from room temperature to 300 ℃;

10. Air extraction system: composed of cryogenic pump+roots pump unit (or mechanical pump)+pneumatic baffle valve;

11. Vacuum measurement: full-range vacuum gauge, measuring range: atmospheric pressure~5 × 10-7Pa, realizing the vacuum degree curve display function during the exhaust process of the vacuum chamber; There is a Pirani low vacuum gauge on the front stage pipeline to realize the safety monitoring of the vacuum pumping system;

12. Control system: the system is controlled by industrial computer and PLC, with automatic and manual control functions,

The operation process is all realized on the touch screen, providing formula setting, vacuum system, electronic gun system, process system, inflation system

Man-machine operation interface such as cooling system; The process and equipment parameters of the program can be set on the industrial control computer by means of configuration parameter setting;

13. Equipment reliability:

The intact rate of equipment is more than 90%; MTBF of equipment is greater than 400 hours;

14. Total rated power: 60KW;

15. Circulating water consumption: 2m3/h;

16. Floor area:

Equipment size: 500 type: 1600 × 2000mm2； Type 700: 1800 × 2200mm2； Type 900: 1600 × 2700mm2；

Size after door opening: 500 type: 2900 × 3000m2； 700 type: 3200 × 3400mm2； Type 900: 3200 × 3700mm2。