Application:
ASHING
Polymer removal
Dry removal of hard mask layer
Photoresistance removal after ion implantation
Photoresistance removal in BAW/SAW process
Dry cleaning of anti reflective graphic film layer
Surface residue removal
Surface cleaning after etching
DESCUM
PLASMA SOURCE |
RF |
RF |
|
Power
|
ICP |
1000w |
1000w |
BIAS
|
600w(option) |
600w(option) |
|
Applicable scope |
4~8inch |
4~8inch |
|
Single processing slice count |
1 |
2 |
|
Appearance dimensions |
1080x1840x1800mm |
1340x2050x1800mm |
|
System control |
Industrial control system |
Industrial control system |
|
Automation level |
automatic |
automatic |