Rapid Thermal Processing / Fully automatic dual chamber RTP
Industry applications
l Oxide, nitride growth
l Ohmic contact rapid alloy
l Annealing of silicide alloy
l Oxidation reflux
l Gallium arsenide process
l Other rapid heat treatment processes
Fully automatic dual chamber RTP
Feature
l Compatible with 6-8inch WAFER
l The maximum temperature can reach 1250°c
l Stable temperature reproducibility
l Fully automatic dual chamber design to increase production capacity
l Uniformity of ultra-high temperature field
l Meet the demand for SlC mass production process
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design customization
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Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
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