MDTFC120 Wafer Two fluid cleaning machine

Model	MDTFC80	MDTFC120
Maximum work piece size	6″＆8″	12″
Cleaning method	Water & air two-fluid cleaning	Water & air two-fluid cleaning
Worktable rotation speed	3000rpm	2800rpm
Control system	PLC	PLC
Human-computer interaction interface	Touch screen	Touch screen
feeding system	Manual feeding	Manual feeding
Workpiece holding	Microporous ceramic vacuum chuck	Microporous ceramic vacuum chuck
Power supply	AC220V,10A	AC220V,10A
Water supply	Purified water，pressure:0.2-0.4Mpa	Purified water，pressure:0.2-0.4Mpa
Water flow	1.5L/min	1.5L/min
Nitrogen	0.3-0.4Mpa	0.3-0.4Mpa
Gas supply	0.6Mpa Cleaned compressed air	0.6Mpa Cleaned compressed air
Machine dimensions	410mm610mm1410mm	600mm680mm1800mm
Net weight	160kg	140kg

1.MDTFC120 Cleaning Machine is suitable for cleaning the work pieces cut by the cutting machine

2.The cleaning can be carried out through calling the preset program according to the work piece size and the cleanliness requirement

3.This machine adopts the water & air two-fluid nozzle to carry out the cleaning, and the high-speed water column form water vapor generated from the nozzle can realize the efficient cleaning under the low breakage degree

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