MDICP-5000F Fully Automatic ICP Etching Machine

System overview

▲Executive summary

The equipment is a two chamber vacuum system. One chamber is the injection sampling chamber and the other is the etching chamber. A vacuum lock is installed between the injection sampling chamber and the etching chamber, and the injection sampling is transported by manipulator.

The equipment is mainly composed of vacuum system, gas circuit system, electrical system, control system, cooling system, film feeding and taking mechanism, alarm system, etc.

▲Vacuum system

The system consists of a molecular pump with a pumping speed of 600 L / S + an imported vacuum dry pump with a pumping speed of L / s to pump the etching chamber to high vacuum. An electric dynamic pressure regulating valve is installed between the molecular pump and the etching chamber. The imported dry pump is the pre pumping pump of the etching chamber and the front stage pump of the molecular pump. Use another mechanical pump with pumping speed of L / s to vacuum the sample chamber. Stainless steel bellows are used for connection between mechanical pump and vacuum chamber and molecular pump, and electromagnetic pneumatic block valve is installed.

▲Constant pressure control system

The equipment is equipped with a downstream constant pressure control system, and an electric adjustable valve is installed in the air extraction pipeline. Through the measurement of film gauge (imported parts), the adjustable valve is controlled to make the vacuum chamber reach constant pressure, so as to improve the process stability.

▲RF power supply system

Two sets of RF power supply with automatic matching.

▲Gas circuit system

Four gas inlets are controlled by four mass flow controllers. 1 / 4-inch stainless steel hard pipe is adopted for gas pipeline, and VCR connection is adopted for pipeline joint connection. The mass flow controller is a joint venture brand, and the gas circuit valves and pipelines are imported parts.▲Control system

It is controlled by industrial computer and PLC, and the parameters are set and the measured values and states are displayed through the touch screen to realize the automation of vacuum system and process. The machine can select full-automatic and non-automatic modes.

▲Alarm system：Safety requirements for equipment.

Mail technical parameter

1. Limit vacuum:  Etching chamber 9.0×10-5Pa (Indoor humidity≤55%)

Injection sampling chamber 6.0×10-1Pa

2. Etching material:  Ⅲ、ⅤMaterial、Si 、SiO2,etc

3. Etching rate:   ~ 1μ/min

4. Etching uniformity: ≤±5％(φ125mm range)

6. Electrode size: φ200mm

Detailed list of equipment configuration (ICP-5000F)