MDAX-FC810 flip chip die bonder
MDAX-FC810 flip chip die bonder
This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips
AX-TL10 fully automatic high-speed solidification machine, composed of multiple sub unit modules:
1、 Linear fixed crystal chip bonding head+flip servo direct connection bonding head
2、 Multi ejector pin design for easy adaptation to different types of wafer sizes
3、 1.3 million resolution visual system for chips and frameworks
4、 Servo direct connected high-precision adhesive coating system
5、 Material box feeding and receiving (customizable online mode)
6、 Solid crystal workbench module, using linear motor and high-precision grating ruler
7、 Calibrate the module and perform X, Y θ correction
Technical specifications
|
UPH |
0.5-3K PCS（Chip related） |
|
X. Y chip position accuracy |
± 10um |
|
Chip angle accuracy |
± 1° |
|
Patch pressure range and accuracy |
30~200g ±10% |
|
Ring size and adaptability |
8 inch 、6inch 、Gel-PAK 、Wafer-PAK |
|
Camera maximum accuracy |
1um |
|
Camera field of view |
1.0mm~8mm |
|
Number of suction nozzles |
2PCS |
|
Lower visual inspection |
5 megapixel high-definition camera, image recognition |
|
Number of thimbles |
1PCS, multiple thimbles (optional) |
|
Attachment materials |
PD &PD Array，LD&LD Array ，Driver ，TIA ，COC组件， TEC ，Wedge ，PLC芯片， Sub mount ， 电阻，电容， etc. |
|
Vehicle size range |
Width:40mm~80mm Length:120mm~170mm |
|
Console height |
950mm ±30mm |
|
Connection method of upstream and downstream equipment |
SMEMA |
|
Power supply |
AC 220V/50Hz |
|
Consumption |
800 W |
|
Compressed gas |
4~6 Bar |
|
External dimensions (WXDXH) (excluding loading and unloading machines) |
1530*1230*1900mm |
|
Net weight |
1400 Kg |
Equipment performance characteristics
1.High speed: According to customer process requirements, achieve the fastest speed in the industry
2.Placement accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip)
Patch angle accuracy: ± 0.5 °
3.Low pressure monitoring: adjustable from 30g to 200g, with controllable error
Multiple structural configurations of Bangtou
4.Multiple image positioning schemes (appearance, feature points, edge finding, circle finding)
Control and detection of the diameter of the first adhesive point
5. Connection mode device, multiple serial devices complete device packaging
