Dual head high speed Die Bonder

Applicable to SMD2020 1010 2121 2835 5730, filament, etc

一、Model characteristics

1. Independent double head die bonding, double stamp arm, double wafer search design, stable and reliable；

2. 90 degree direct connection high-precision servo Bonding head；

3. Adjustable constant temperature direct connection high-precision stamp head；

4. Linear motor wafer table and die bonding working table；

5. Vacuum die missing detection;

6. Automatic loading and unloading system is adopted to reduce refueling time；

7. Visual quality inspection system, such as glue quantity detection, anti dazzle detection, post die bonding detection, etc；

8. Simple visual operation interface simplifies the operation of automation equipment；

二、Specifications

1）system function

production cycle：≥40ms Speed depends on chip size and bracket size

Die placement accuracy：±25um

Chip rotation：±3°

2）Wafer stage

Chip size：3.5mi1×3.5mi1-80milx80mil

Support specification：L（L):120-200mm W（W):50-90mm

Chip maximum angle correction：±180°(Optional）

Maximum chip ring size/Max. Die Ring Size：6"

Maximum chip area size：4.7"

Rerolution：1μm

Height stroke of ejector：3mm

3）Image recognition system

Gray scale：256Grayscale

resolving power：752×480pixel

Image recognition accuracy：±0.025mil@50mil Observation range

4)       Suction swinging arm system

Die bonding swing arm：90 ° rotatable

Picking up pressure：Adjustable 20g-250g

5）Die bonding work table

Travel range：75mm*175mm

XY resolving resolution：0.5μm

6）Leadframe support size

Support length：120m~170mm(Customized if the length is less than 80~120mm of the support）

Support width：40mm~75m(30~40mm lower than the width of the support, customized）

7）Required facilities

Voltage/frequency：220V AC±5%/50HZ

compressed air：0.5MPa (MIN)

Rated power：950VA

Air consumption/Gas Consumption：5L/min

8）Volume and weight

L x W x H：135×90×175cm

weight：1200kg