MD-1412 High precision die bonder

This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the leadframe by linear guide.

Description	MD-1412 Die Bonder Machine
UPH	5 ~ 6K（swing arm and linear motion）
Placement accuracy	±25um
Die rotation	+/- 2°
Die size	6553 Sensor die:2.12212mm 6100 Sensor die:1.651.65mm 3224 Asic die:1.201.27mm I-Lite Asic die:1.961.51mm
Bondline thickness control	Yes,Pressure control mode
Substrate size
Length	76(Can be customized according to customer requirements)
Width	101(Can be customized according to customer requirements)
Thickness	(Can be customized according to customer requirements)
Wafer system
Standard	Contains 12-inch wafer ring mechanism and chip box clamping mechanism; thimble assembly; XY table;10 inch, 12 inch, 14 inch metal frame fixture, manual adjustment; Standard dispensing needle adhesive dispensing
Standard	6"wafer size [ 10" metal frame ] 8"wafer size [ 12" metal frame ] 12"wafer size [ 14" metal frame ]
Facilities required
Voltage	220 VAC
Full load current	NA
Frequency	50Hz
Power consumption	600 ~ 1000W
Compressed air	Min 6 bar [ 87psi ]
Dimension & Weight
W x D x H	2000mm x 1200mm x 1800mm
Weight	1700kg

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