Manual Wire Bonder
Application
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.
Specification
1,electric requirement：220VAC±10％、50HZ、be sure connected to ground
2,wire diameter：25～75μm
3,ultrasonic power：0－3W, 60kHz, two channel. can be set separately of the two point
4,bond time：5－200ms，two channel
5,bond force:10－60g，two channel
6, span between first bond to second bond by automatic mode:0-10mm(motorized)
7,bond radian: 0-6mm(motorized)
8, jig moving area: Φ16mm
9,mouse hand:20*20mm
10,digital camera: optional
11,dimension:600*560*390mm
12,weight:36kg
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design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
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