Manual Gold Wire Ball Bonder
Application
LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
Specification
1,electric requiement：220VAC±10％、50HZ、be sure connected to ground
2,wire diameter：17～50μm
3,ultrasonic power：0－3W, two channel. can be set separately of the two point
4,bond time：0－200ms，two channel
5,bond force:35－180g，two channel
6,digital camera systerm：optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm.
9,length of terminal wire: 0-2mm
10,ball dimension：2-4 times bigger setable
11,bond temperature: house temperature ~ 400℃
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm
15,weight:28kg
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design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
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