Manual Epoxy die bonder
Features:
1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc.
2. Realize the soft contact of the suction nozzle, effectively solve the problem of the active area such as the air bridge on the surface of the GaAs chip
3. Non-damage flattening adjustment for uneven patch or large-sized chips
4. Dispensing and patch are integrated, integral, convenient or double-head patch function, improve efficiency
Product advantages
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Function: |
Automatic scribing, dispensing, sticking |
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Bonded Chip Size: |
0.2-25mm |
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Adhesive pressure: |
10-150g |
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Lifting table size: |
X-Y:250*270mm Z:18m |
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Control platform effective travel: |
X-Y:10mm*10mm Z:25mm |
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Motion Control Platform Accuracy: |
0.2um |
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Nozzle rotates 360° |
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Chinese self-naming parameter file name storage, easy to remember |
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With automatic height detection function |
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Later upgradeable epoxy eutectic machine |
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Product maintenance
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Parameters |
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power supply: |
AC220V±10%，50-60HZ，≤400W |
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Compressed air>=0.5MPa |
Vacuum pipeline <-0.08MPa |
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External dimensions: |
800*380*450mm |
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weight: |
70KG |
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stable workbench keep away from vibration sources |
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There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours
