Manual Epoxy and Eutectic Die Bonder

The MDSJHYZPGJ0225 series pick-and-place machines are primarily used to mount chips or microelectronic components onto PCB substrates, metal housings, or silicon wafers using epoxy adhesive or alloy solder.  They are essential key equipment in the post-assembly process of semiconductor production lines.

Depending  on the substrate material of  the   mounted   chip,   pick-and-place   machines   are categorized into the MDSJHYZPGJ0225E epoxy pick-and-place machine,  MDSJHYZPGJ0225E  dual-head pick-and-place machine, MDSJHYZPGJ0225CU nozzle reflow machine, MDSJHYZPGJ0225U clamp reflow machine, and MDSJHYZPGJ0225EU epoxy pick-and-place reflow integrated machine.

The MDSJHYZPGJ0225 series pick-and-place machines incorporate the following unique designs  to enhance the pick-and-place process:

(1) The XYZ servo motion control platform can accurately control the XYZ.

(2)  Adoption of an industrial PC enables user-friendly human-machine interaction and facilitates operation recording and data traceability.

  Application:

Microwave  Devices,  Hybrid  Circuits,  RF  Devices/Modules,  Separation  Devices,  Sensors,  COB Modules, MCM, MEMS Devices, Optoelectronic Devices, etc.

Product Model Definition:

Compatibility:

*Adapt to multi-sized chips without custom nozzles

*Adapt to all kinds of solder epoxy patch & eutectic patch

Safety:

*Accurate positioning with automatic height detection

*Program-controlled clip opening and closing does not damage the chip

*Clamping force is stable

Stability:

*Servo motor drive for smooth operation

*The integrated electronic control system has a low failure rate

*Industrial Panel PC

Adaptability:

*Optional pulse heating method, fast heating and cooling speed

We have customized the entire IC Package production line equipments for our customers, including Plasma Surface Treatment, Oven, Die Bonder, Wire Bonder, for laboratory use.