High Grade Automatic Heavy Wire Bonder
DAWB-HC300 is an Automatic Aluminium Heavy Wire Bonder with adaptive closed loop ultrasonic power and bond force control capabilities. Together with intelligence contact sensing and precision motion control result to consistence and quality bonding.State-of-the-Art Control Development System (CoDeSys) enabled the digital control to the last meter which highly increases the machine reliability and scalability. Highly optimized digital image capture system greatly reduces the PR alignment time and enhance the successful rate.
MDAWB-HC300 is engineered to process a wide range of electronilc products such as electric car 18650 battery, 26800 lithium battery ,IGBT devices and most of the power devices that require heavy wire bonding.
Features:
1. High speed smart contact detection improves bond quality
2. High Speed Digital Camera for vision alignment
3. Snapshot vision system greatly improve image stability
4. Closed loop bond force control
5. Stable bond force control better bond quality and reliability
6. Programmable voice-coil bond force control system
7. Programmable ultrasonic power at various bond stages
8. Linear motorized Bond Head
9. Real time bond wire length monitoring
10.High precision linear guides and grinding grade ball screws
Technical Specifications:
Bond Head Mechatronic System
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θTheta rotational axis: |
+/-360 @ 0.01 degree resolution |
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X axis: |
420mm @ 1um resolution |
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Y axis |
360mm @ 1um resolution |
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Z axis: |
100mm @ 1um resolution |
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Grinding grade ballscrew for precision and long term reliability High speed voice-coil motor for bond force control |
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Vision System
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Camera: |
Moving GE Digital Camera @640x480 pixels |
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lmage size: |
Optic Depending |
Facility Requirements
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Power Supplies: |
AC220V,50Hz,1000W |
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Optional |
AC 110,50Hz |
Physical Dimension
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Dimension |
approx. Heigh 1800mm , Width 800mm , Depth 128Cmm |
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Weight |
approx.450 Kg |
Wire Bonding Capability
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Wire size: |
5 mil to 20 mil(100um - 500um) |
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Ribbon wire : |
1.4x0.25 mil to 10.0x1.0 mil |
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Wire Termination: |
Front Cut |
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Wire feed system: |
Motorized with High Resolution Encoder Feedback |
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Wire loss detection: |
Encoder and Bond Power Detection Method |
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Maximum Wire Length: |
Realtime Monitoring |
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Max.loop height |
Programmeable |
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Min.loop height |
Programmeable |
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Bond Force: |
50g~3500g |
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Ultrasonic Transducer: |
60+/-2 KHz |
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Ultrasonic generator: |
60KHz,100W |
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Typical Bonding cycle time: |
Productivity: Typical 3.2K wires per hour |
