Automatic Die bonder / Die sorter for IC TO package

MDAX-DS360  MD-AX380  Die Sorter Technical specification

Worktable (Linear Module)

Optics System 

Worktable stroke:150x250mm(2" tray *8 pcs;can customize)

Camera  

Resolution:1μm

Optics Magnifier (wafer) :0.7 times to 4.5 times
optional bigger one

Wafer Table (Linear Module)

Cycle Time   200MS/EA

XY stroke:8"*8"(MDAX-DS360);12"*12"（MDAX-DS380)

Die bonding cycle is less than 250 milliseconds,
production capacity is greater than 12k;

Resolution: 1μm

Rotary wafer table:optional

Loading and unloading module

Manual upload and download

Wafer placement accuracy

optional magazine upload and dowload

Adhesive die position:±25um

Rotation accuracy:±3°

Dispensing module

Equipment Require 

optional stamp method for bonding usage

Voltage: AC220V/50HZ

Air Source:minimum6BAR

Vacuum Source:700mmHG（Vacuum pump）

Power Consumpion ：3000w

PR System

Dimensions And Weight

Method:256 grey levels 

Weight :1000kg

Detection : ink/chipping/cracked die

Size(DxWxH)外型尺寸                1300*1400*1700mm

Monitor :17"LCD

Missing Die :yes

Monitor Resolution:1024*768

Vacuum Sensor