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SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 1
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 2
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 3
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 4
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 5
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 1
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 2
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 3
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 4
SPMV-100HT Vacuum Microwave Plasma Cleaning Machine 5

SPMV-100HT Vacuum Microwave Plasma Cleaning Machine

Summary:

Microwave plasma cleaning machine, SPMV-100H is a low-pressure microwave plasma cleaning system, which is used for surface pretreatment before SMT, wire bonding, packaging and other processes. The freely moving electrons generate Plasma and enter the magazine where the cavity is located for process cleaning. A large amount of sustained plasma can be generated by applying microwaves at a frequency of 2.45 GHz to a window in the wall of the vacuum cavity. The cavity is suitable for different size cartridges.SPMV-100H can provide fast non-destructive plasma cleaning effect. The plasma cleaning effect of the system is achieved by the generation of activated free radicals through the cartridge.

Features:

The product placement fixture is flexible and can adapt to irregular products

Electrodeless microwave design can meet the processing needs of soft products.

No UV radiation

Low temperature plasma to avoid thermal damage to the product

Electrically neutral plasma, no electrical damage to products

Equipped with magnetic fluid rotating frame to increase the uniformity of Plasma treatment

Efficient and uniform microwave plasma output to ensure etching efficiency

Industry application:

PCB/FPC industry: hole drilling and surface cleaning, coverlay surface roughening and cleaning

Semiconductor industry: semiconductor packaging, camera modules, LED packaging, BGA packaging, Wire Bond pretreatment

Ceramic: packaging, pre-dispensing treatment

Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon wafer PN junction removal, ITO film etching

Plastic materials: Teflon Teflon surface activation, ABS surface activation, and other plastic materials cleaning activation

Surface cleaning before ITO coating

 

Equipment Specification:

Power Systems

Power Type

Microwave power

Power

0~1250W

Frequency

2.45GHz

Vacuum System

Two-stage rotary vane pump (oil pump)

60m3/hOptional dry pump

Vacuum line

All stainless steel pipes, and high-strength vacuum bellows

Material

Aluminum alloy (customized stainless steel cavity)

Thickness

25mm

Tightness

Military grade welded seal

Inner Chamber size

450×450×450mmW×H×D

Workspace

6 magazine sections

ECR

Slotted Magazine and provides ECR enhanced treatment

Tray rotation

Magnetic fluid control tray rotation

Gas system

Flow range

0~300SCCM

Process gas circuit

Standard two-way

CF4 gas optional

Control System

System control

PLC

Interactive mode

7 inch touch screen

Other specification

Machine size

1300×2100×1200mmW×H×D

Weight

250KG

Color

Silver grey

Factory specifications require

AC Power Specifications

Power supplyAC380V50/60Hz5-wire50A

Factory exhaust

Flow 2.0 m³/min

Factory working gas requirements

Flow1~10 L/min

Pressure 3~7 kg/cm²

Pipe diameter 6×4 mm

Material PU tube

purity 99.99% above

Factory compressed air requirements

Flow1~10 L/min

Pressure 3~7 kg/cm²

Pipe diameter 8×5 mm

Material PU tube

dew point -40below

Particle0.3μm10Pcs/ft³

General Specifications:

Danger signs

High Voltage Hazard Sign

Use environment

Temperature 15~30

Humidity 30~70%

Other considerations

No flammable gas, corrosive gas, explosive or reactive dust

Cylinders need to be fixed

Quality assurance and after-sales service:

1、The warranty period is 1 year. During the warranty period, damaged parts shall be replaced free of charge under normal use

2、If the operation is within the safety range that the equipment cannot meet, resulting in the damage of relevant parts, our company will not be liable for compensation

3、In case of equipment damage caused by force majeure disasters such as earthquake, fire, typhoon and tsunami, our company is not responsible for compensation

4、Our company will not be liable for any direct or indirect damage to the equipment caused by non use of original parts

5、If the equipment is damaged or defective due to improper design, our company will replace the defective or damaged parts free of charge

6、After the warranty period, your company shall be responsible for the consumables and service costs required for replacing parts.

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