Precision Grinder Minder Machine Brand
Product details of the precision grinder
Product Introduction
Guangzhou Minder-Hightech Co.,ltd provides various custom-made precision grinder for your selection. Its quality competitiveness index has kept stabilized over the years. The product, highly recommended by users, has great market potential.
Product Introduction
--- Substrate grinder
Related Parameters
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Regular Specification |
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Machine Series |
MDFD250HG |
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Work Table Diameter |
Φ250 mm / 10 inches |
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Maximum Grinding Diameter |
Φ250 mm |
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Minimum Grinding Thickness |
T≥35μm （12” with carrier） |
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Grinding Roughness |
Ra≤0.02μm (with abrasive of grains grits 2000) |
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Feeding Resolution |
RES = 0.1 μm |
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Grinding Feeding Speed |
0.1 ~ 10μm/sec (grinding feeding speed) |
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Fast Feeding Speed |
0.01 ~ 1mm/sec (from origin point to pre-feeding position) |
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No. of Worktable |
1 |
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Wheel Rotate Speed |
0-3000 rpm |
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Worktable Rotate Speed |
0-300 rpm |
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Upper Spindle Power |
Electric Spindle 5.5kW |
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Lower Spindle Power |
Electric Spindle 2.2kW |
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Coolant Tank Volume |
75L |
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Pulse Hand Wheel Resolution |
1×, 10×, 100× |
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Pneumatic Source |
0.6-0.8MPa |
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Total Weight |
1200 kg |
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Dimension |
1150×1200×2000 mm |
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Optional Choice |
Specification |
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Non-Contact (Infrared) Thickness Gauge |
Brand: Marposs Resolution：0.1μm Measurement Precision: ≤0.5μm |
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Contact Thickness Gauge |
Brand: Marposs Resolution：0.1μm Measurement Precision: ≤0.5μm |
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(Upper Spindle) Aerostatic Graphite Electric Spindle |
Power: 5.5kW Spindle Balance：0.05μm（3000rpm) |
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Grinding Wheel |
Grains Grits Size: 320 to 6000 Abrasive Material |
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Process Type |
Sort by Process Material |
Sort by Application |
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Substrate thinning |
Metals and alloys Industrial ceramics Oxidizing substances Carbonized substance glass plastic |
Semi Conductor |
Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc. |
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Resin |
PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
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PCB |
Adhesive, coating, circuit |
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Optical |
Optical lenses, optical reflectors, scintillation crystals, holographic projection glass, HUD glass, screen glass |
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Radar |
Oxide skin plate |
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Features
ApplicationS
Mainly used at silicon wafer, ceramic, glass, quartz crystal, sapphire, semiconductors precision thinning (grinding)
Company Advantage
• Minder Machine introduces a group of experienced and professional talents. They are committed to providing technical support for the production of high-quality products which greatly improves corporate core competency.
• Minder Machine adheres to the service concept to be customer-oriented. We are widely recognized in the market due to quality products and excellent services.
• Minder Machine's location is close to railways and major highways, which is conducive to the transportation of various products. And there are areas around that could be used for construction.
• Established in Minder Machine has gone through ups and downs for years. We embrace today's outstanding achievements among difficulties and hardships, and form our own unique development path.
Dear customer, thanks for your support! Minder Machine always provides quality machinery and professional service in return for new and old customers. We are sincerely welcoming your consultation and cooperation!
