Minder Machine Brand Die Bonding Machine Factory

Product details of the die bonding machine

Product Information

The production technology of Minder Machine die bonding machine has been greatly improved by our dedicated R&D team. Modified by several times, die bonding machine can be applied into many different places. Quality assurance is guaranteed in Minder Machine.

Product Introduction

--- MDAX64DI-25-3 Planar Dual head high-speed Die Bonder

Applicable to SMD2020 1010 2121 2835 5730, filament, etc

Related Parameters

System Function	Production Cycle	≥40ms Speed Depends On Chip Size And Bracket Size
	Die Placement Accuracy	±25um
	Chip Rotation	±3°
Wafer Stage	Chip Size	3.5mi1×3.5mi1-80milx80mil
	Support Specification	L(L):120-200mm W(W):50-90mm
	Chip Maximum Angle Correction	±180°(Optional)
	Maximum Chip Ring Size/Max. Die Ring Size	6"
	Maximum Chip Area Size	4.7"
	Rerolution	1μm
	Height Stroke Of Ejector	3mm
Image Recognition System	Gray Scale	256Grayscale
	Resolving Power	752×480pixel
	Image Recognition Accuracy	±0.025mil@50mil Observation Range
Suction Swinging Arm System	Die Bonding Swing Arm	90 ° Rotatable
Suction Swinging Arm System	Picking Up Pressure	Adjustable 20g-250g
Die Bonding Work Table	Travel Range	75mm*175mm
Die Bonding Work Table	Xy Resolving Resolution	0.5μm
Leadframe Support Size	Support Length	120m~170mm(Customized If The Length Is Less Than 80~120mm Of The Support)
Leadframe Support Size	Support Width	40mm~75m(30~40mm Lower Than The Width Of The Support, Customized)
Required Facilities	Voltage/Frequency	220V Ac±5%/50Hz
	Compressed Air	0.5Mpa (Min)
	Rated Power	950Va
	Air Consumption/Gas Consumption	5L/Min
Volume And Weight	L x W x H	135×90×175cm
Volume And Weight	Weight	1200kg

Features

Independent double head die bonding, double stamp arm, double wafer search design, stable and reliable；

90 degree direct connection high-precision servo Bonding head；

Adjustable constant temperature direct connection high-precision stamp head；

Linear motor wafer table and die bonding working table；

Vacuum die missing detection;

Automatic loading and unloading system is adopted to reduce refueling time；

Visual quality inspection system, such as glue quantity detection, anti dazzle detection, post die bonding detection, etc；

Simple visual operation interface simplifies the operation of automation equipment

Company Advantage

• Minder Machine has a high-quality management team, excellent R & D team, intimate service team, and also set up a professional distribution team to provide a good guarantee for product development, sales services, transportation, and distribution.
• The quality of our products has reached the international first-class standard. Our products have been in great demand at the market, and won wide popularity from consumers.
• Our company is close to the road with convenient transportation. It facilitates the transportation of products and guarantees the timely supply of products.
• Minder Machine insists on providing high-quality services for customers. We do that by establishing a good logistics channel and comprehensive service system covering from pre-sales to sales and after-sales.
industrial machinery produced by Minder Machine feature good design, novel style and diverse specification. You can choose freely according to your needs. If you want further information, feel free to contact us.

we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.

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