Grinding Machine for Sale Minder Machine Brand Grinding Machine for Sale

Inquiry

Product Introduction

--- Substrate grinder

It is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.

Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.

Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary, speed 3-140 adjustable.

Grinding wheel: the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/ 300mm type. the granularity (roughness) of the grinding wheel is depend on the process.

Related Parameters

Regular Specification
Machine Series	MDFD250HG
Work Table Diameter	Φ250 mm / 10 inches
Maximum Grinding Diameter	Φ250 mm
Minimum Grinding Thickness	T≥35μm （12” with carrier）
Grinding Roughness	Ra≤0.02μm (with abrasive of grains grits 2000)
Feeding Resolution	RES = 0.1 μm
Grinding Feeding Speed	0.1 ~ 10μm/sec (grinding feeding speed)
Fast Feeding Speed	0.01 ~ 1mm/sec (from origin point to pre-feeding position)
No. of Worktable	1
Wheel Rotate Speed	0-3000 rpm
Worktable Rotate Speed	0-300 rpm
Upper Spindle Power	Electric Spindle 5.5kW
Lower Spindle Power	Electric Spindle 2.2kW
Coolant Tank Volume	75L
Pulse Hand Wheel Resolution	1×, 10×, 100×
Pneumatic Source	0.6-0.8MPa
Total Weight	1200 kg
Dimension	1150×1200×2000 mm

Optional Choice	Specification
Non-Contact (Infrared) Thickness Gauge	Brand: Marposs Resolution：0.1μm Measurement Precision: ≤0.5μm
Contact Thickness Gauge	Brand: Marposs Resolution：0.1μm Measurement Precision: ≤0.5μm
(Upper Spindle) Aerostatic Graphite Electric Spindle	Power: 5.5kW Spindle Balance：0.05μm（3000rpm)
Grinding Wheel	Grains Grits Size: 320 to 6000 Abrasive Material

Process Type	Sort by Process Material	Sort by Application
Substrate thinning	Metals and alloys Industrial ceramics Oxidizing substances Carbonized substance glass plastic	Semi Conductor	Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.
		Resin	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		PCB	Adhesive, coating, circuit
		Optical	Optical lenses, optical reflectors, scintillation crystals, holographic projection glass, HUD glass, screen glass
		Radar	Oxide skin plate

Features

Grinding wheel main axis: frequency control of motor speed, 3000-8000 adjustable.

Guide screw feeding part: high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable, it is checked by grating ruler. this machine is very easy for operator.

ApplicationS

Mainly used at silicon wafer, ceramic, glass, quartz crystal, sapphire, semiconductors precision thinning (grinding)

GR (1)

GR (2)

GR (3)

Company Advantages

· Minder Machine grinding machine for sale has gone through some necessary tests. It has been investigated with regard to breathability, thermal rating, water rating, slip resistance and impact resistance.

· The product is put into the market after rigorous inspection.

· Taking grinding machine for sale as our priority is a very important part for our growth.

Company Features

· Guangzhou Minder-Hightech Co.,ltd mainly develops, designs, and produces high-quality grinding machine for sale. We have made much effort to maintain our dominant position in the market.

· Good market reputation and brand, a strong R&D team and innovative ideas for grinding machine for sale, solid Guangzhou Minder-Hightech Co.,ltd's future development.

· We are committed to a sustainable development of our Minder Machine brand. Inquire!

Application of the Product

Minder Machine's grinding machine for sale is widely used in the industry and is widely recognized by customers.

Minder Machine is dedicated to providing professional, efficient and economical solutions for customers, so as to meet customers' needs to the greatest extent.

we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.

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