Die Bonder Equipment

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Product Introduction

--- MDAX64DI-25-3 Planar Dual head high-speed Die Bonder

Applicable to SMD2020 1010 2121 2835 5730, filament, etc

Related Parameters

System Function	Production Cycle	≥40ms Speed Depends On Chip Size And Bracket Size
	Die Placement Accuracy	±25um
	Chip Rotation	±3°
Wafer Stage	Chip Size	3.5mi1×3.5mi1-80milx80mil
	Support Specification	L(L):120-200mm W(W):50-90mm
	Chip Maximum Angle Correction	±180°(Optional)
	Maximum Chip Ring Size/Max. Die Ring Size	6"
	Maximum Chip Area Size	4.7"
	Rerolution	1μm
	Height Stroke Of Ejector	3mm
Image Recognition System	Gray Scale	256Grayscale
	Resolving Power	752×480pixel
	Image Recognition Accuracy	±0.025mil@50mil Observation Range
Suction Swinging Arm System	Die Bonding Swing Arm	90 ° Rotatable
Suction Swinging Arm System	Picking Up Pressure	Adjustable 20g-250g
Die Bonding Work Table	Travel Range	75mm*175mm
Die Bonding Work Table	Xy Resolving Resolution	0.5μm
Leadframe Support Size	Support Length	120m~170mm(Customized If The Length Is Less Than 80~120mm Of The Support)
Leadframe Support Size	Support Width	40mm~75m(30~40mm Lower Than The Width Of The Support, Customized)
Required Facilities	Voltage/Frequency	220V Ac±5%/50Hz
	Compressed Air	0.5Mpa (Min)
	Rated Power	950Va
	Air Consumption/Gas Consumption	5L/Min
Volume And Weight	L x W x H	135×90×175cm
Volume And Weight	Weight	1200kg

Features

Independent double head die bonding, double stamp arm, double wafer search design, stable and reliable；

90 degree direct connection high-precision servo Bonding head；

Adjustable constant temperature direct connection high-precision stamp head；

Linear motor wafer table and die bonding working table；

Vacuum die missing detection;

Automatic loading and unloading system is adopted to reduce refueling time；

Visual quality inspection system, such as glue quantity detection, anti dazzle detection, post die bonding detection, etc；

Simple visual operation interface simplifies the operation of automation equipment

Company Advantages

· There are two ways to quickly build Minder Machine die bonder equipment. One is by stacking them together and cutting the openings, welding the sides and constructing the electrical and pipe networks, and the other is to cut and create all the necessary networks before you begin the stacking and positioning process.

· This product is safe to use. There are no harmful or potentially harmful chemicals contained in its materials and paintings.

· It will effectively support users' today and long-term needs.

Company Features

· Guangzhou Minder-Hightech Co.,ltd is a manufacturer which produces die bonder equipment in high quality and nice design.

· We carefully plan our production facilities to incorporate the latest technology and the most advanced machinery, tools, and equipment, so that we can manufacture the highest quality products possible.

· This is our unique culture - we will treasure the inherent worth and dignity of those people we work with and serve to make a lasting change.

Application of the Product

Minder Machine's die bonder equipment can be used in different industries to meet the needs of customers.

According to different needs of customers, we could customize comprehensive and efficient solutions for them.

we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.

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Minder-Hightech become a very popular brand in industrial world. We created "MinderPack" to focusing on the machinary on packages solution and other high value machines.