MDZC-1000 Wafer level Laser Solder Ball Placement Machine 1

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 2

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 3

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 4

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 5

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 6

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 7

MDZC-1000 Wafer level Laser Solder Ball Placement Machine 8

MDZC-1000 Wafer level Laser Solder Ball Placement Machine

Laser solder ball placement soldering technology

https://www.youtube.com/embed/odfveKT8pjM

MDZC-1000 Wafer level Laser Solder Ball Placement Machine

Laser solder ball placement (soldering) technology can be applied to both lead and lead-free solder balls; Such as SnPb (lead tin), AuSn (gold tin), AgSn (silver tin), SnAgCu (tin silver copper), etc.

Laser tin ball placement(soldering) technology can achieve tin ball welding with a minimum diameter of 60um and a maximum diameter of 2000um. According to customer products and requirements, there are multiple tin ball diameters to choose from.

Now, we already mass product 70um ball to wafer placement, and min60um for R&D usage.

Character:

1,Small footprint (length x width=1200mm x 1300mm)

2,Equipped with safety grating to protect the safety of operators

3,Marble base, stable structure, guaranteed accuracy/speed

4,Optional standard tin ball diameter 250um-750um (one specification per 50um)

5,Optional microspheres (diameter 70um-200um)/large balls (diameter 800um-2000um); Need to confirm in advance

6,Independently developed software, easy to operate and quick to get started

7,The laser has a long lifespan, and imported lasers are used, with a lifespan of up to 100000 hours

8,Configure a laser power feedback system to achieve precise control of the laser

Principle:

Part of photos:

Specifications:

Model number	MDZC-LBP500	MDZC-LBP1000	MDZC-LBP7076
Laser power	20w or 50w	100w	20w+100w(dual)
Laser wavelength	1064nm
Cooling method	Full air cooling
Placing ball diameter	200 um-760um	70 um-200um	70-760um
Motion control	PC+ motion control card
Positioning method	CCD positioning
2D inspection	Optional	Optional	Not available
Repetition precision	±5 um	±7um	±5um
Chuck table	Vacuum chuck
Process range	150*150mm
Ball planting efficiency	≥3 balls /S
Nozzle counterpoint	Automatic calibration
Power supply	AC220V 50Hz
Computer	I5 ,win10
Temperature and humidity	22-30°C 20-70% (non-condensating)
Weight	1200Kg	1600 kg	1700kg
Overall dimensions	1200(L)1350(W)1800(H)mm

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